According to LightCounting’s CEO Vladimir Kozlov, the surge in AI development has triggered a fresh wave of demand for optical connectivity between 2023 and 2025, and that momentum is expected to ...
“More compiler testing is always better,” Solid Sands CEO and cofounder Marianne Damstra said. Solid Sands has acquired the assets of Plum Hall for an undisclosed sum. The deal brings together two ...
On this page, EE Times Europe covers the latest news, market trends and perspectives in artificial intelligence (AI).
The push toward semiconductor sovereignty grows even more important as geopolitical factors, market turbulence, export controls and trade tensions threaten to upset the delicate balance on which the ...
Latvia uses 5G conference to declare semiconductor ambitions and utilize 5G, AR/VR skills to build its own open metacity. Twelve partners from industry, government, and academia in Latvia last week ...
Even discounting the overly optimistic expectations of the recent past, it’s clear that autonomous vehicles will have a major impact on the automotive and transportation industries. The AV era is not ...
Electrical stimulation of peripheral nerves modulates activity in the organs and the brain. Imec develops miniature implants for the peripheral nervous system, tackling challenges for precise ...
Despite the challenging market conditions in 2023, a 9% to 12% recovery is expected in 2024. The semiconductor market faced a slowdown in 2023, with a projected 9% decline compared with 2022. The ...
Could a pair of glasses be the next big computing platform? Marco Angelici, MEMS Micro Actuators Business Unit director at STMicroelectronics, thinks the 2020s will be the decade when ...
The AI GPU trend accelerated Nvidia’s market value and revenue, and it is now one of the three most valuable companies in the world based on market capitalization. Nvidia’s Developer Conference has ...
One problem to be solved for the future of humanity is related to energy, global warming, and the depletion of fossil fuels. Panasonic is deploying significant financial and technical resources to ...
For many applications, next-generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.