3D printing allows a new, lightweight plastic-ceramic composite to be tailored to specific shapes and sizes Northeastern ...

Peter Dijkstra, Chief Commercial Officer at Trymax Semiconductor Equipment, discusses the landmark installation of the company’s 500th process chamber in Asia, marking strong progress toward the goal ...

Ralf Bornefeld, Senior VP, General Manager Business Unit Power Semiconductors and Modules at Bosch, discusses the many SiC-based power electronics innovations the company demonstrated at PCIM earlier ...

Nexperia has announced two 1200V 20A SiC Schottky diodes designed to address the demand for ultra-low power loss rectifiers ...

Distributor Richardson Electronics has announced a technology partner agreement with Pakal Technologies, a US-based silicon ...

Rohm has developed a 30V N-channel MOSFET in a common-source configuration that achieves an industry-leading ON-resistance of ...

Singapore has opened the National Semiconductor Translation and Innovation Centre for GaN; the country's first national ...

For the last year Japanese chemical company Resonac and Tohoku University have been exploring using SiC powder, produced from ...

Troubled US SiC semiconductor company Wolfspeed has appointed Gregor Van Issum as CFO, effective September 1, 2025. He ...

Poshun Chiu, Senior Technology & Market Analyst, Compound Semiconductors at Yole Group, discusses the power silicon carbide device market, outlining the anticipated growth to an anticipated $10.

Mark Ng, TI Director of Automotive Systems, talks through several innovations featured by the company at the PCIM event, including the first automative qualified inductor-inductor-capacitor (LLC) ...