ChipAgents has introduced Renoir, an agentic large language model (LLM) whose name means “renew.” In early chip design ...
At the recent Data Center World 2026 in Washington, D.C., one message came through louder than ever: AI infrastructure is ...
On-die monitors, localized analytics, and lifecycle data are giving architects new ways to close the gap between design ...
Supports higher throughput, reduced cycle time, and lower cost per package, while enabling integration of increasingly ...
Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training ...
ULVAC’s Brian J. Coppa, Micron’s Amit Srivastava, SEMI’s Mark da Silva, and SEMI’s Anshu Bahadur propose a comprehensive semiconductor industry roadmap covering carbon emissions, water, and hazardous ...
Researchers from University of Wisconsin-Madison and AMD Research and Advanced Development published a technical paper titled ...
AI scalability will require full-stack co-optimization, not just bigger data centers. AI workloads require a 10X compute efficiency gain over 10 years, making collaboration across algorithms, ...
When is a complex chip design ready to be shipped to manufacturing?
Agentic AI has the potential to make engineers more productive, speed time to market, and automate some of the drudge work. The big challenge for design and verification engineers is where and whether ...
More steps in the design flow are shifting left, which makes a complicated design process even more complex. This includes early software prototyping, workload mapping, verification, multi-physics ...
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