AMCM has integrated its EOSPRINT software with PanX to bring physics-based simulation directly into build preparation for ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Rising power density and chiplet complexity drive thermal considerations earlier in the design process. Thermal is becoming an architectural constraint, requiring trade-offs in power, performance, ...

As electronic devices become increasingly miniaturized, heat management at the nanoscale emerges as a challenge, especially for devices operating in sub-microns. Traditional heat conduction models ...

High power density power-supply modules based on gallium nitride (GaN) devices are core components in the automotive, industrial and data-center sectors. As their integration level and power density ...

E Network is integrating CFD simulation and Digital Twin technologies into its Mikkeli AI data center in Finland, extending ...

Flotherm 5 thermal management simulation software offers improvements in the areas of usability, CAD import, compact modeling and numerical stability. The tool supports emerging JEDEC guidelines on ...

Figure 1. SimuReal simulation with heat mapping. Heat mapping is integrated into Coriolis Composites’ SimuReal software, correcting for IR camera incidence angle (IR camera seen at far top right) to ...

China-based Micronewton has supplied a university laboratory system featuring a water-to-air heat exchanger test bench ...

Integrated multiphysics analysis enables engineers to validate complex system interactions early, reducing costly physical ...