Figure 1. Ultrasonic testing using pulse echo and through-transmission methods. Pulse echo (left and center) uses a transducer that sends and receives ultrasound energy, producing both A- and B-scan ...

Researchers have developed a new method for detecting defects in additively manufactured components. Researchers at the University of Illinois Urbana-Champaign have developed a new method for ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

In order to detect defects in the surfaces of dry fabric and composite prepreg, this new vision-based tactile sensor roller prototype, TacRoller, is a three-colour reflective membrane roller-shape ...

Developments in techniques for detecting cracks and structural defects could yield monitoring systems that enhance safety while reducing inspection time and cost. Two technologies in particular show ...

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...