High-speed hydrogen-free encapsulation using FCVA deposition improves OLED moisture barrier performance, preserves TFT stability, and nearly doubles flexible device lifetime compared with ALD.

These industry titans lead with vertically integrated R&D capabilities, extensive processing expertise, and global ...

LAS VEGAS, Dec. 16, 2025 /PRNewswire/ -- Avant Technologies, Inc. (OTCQB: AVAI) ("Avant" or the "Company"), an emerging biotechnology company focused on developing cell-based therapies for diabetes ...

OSAKA, Japan--(BUSINESS WIRE)--Panasonic Corporation today announced that it developed a semiconductor encapsulation material for power devices that boasts the industry's top-class *1 heat-resistance ...

Top-tier investor syndicate co-led by Khosla Ventures and SV Latam Capital (SVLC) with participation from Sandhill Angels and Y Combinator The financing will be used to expand the team and prepare its ...