Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

The post Apple's M5 Pro & M5 Max Rumored for Single-Chip Design appeared first on Android Headlines.

Macworld examines a theory suggesting Apple may use 2.5D chip packaging to create a unified M5 Pro and M5 Max design, potentially revolutionizing MacBook Pro architecture. This approach could ...

Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

TL;DR: Apple and Bitmain will lead demand for TSMC's cutting-edge 2nm process node in 2026, with TSMC ramping capacity to 60,000 wafers monthly by Q4. NVIDIA will adopt TSMC's 3nm node for Rubin AI ...

Apple's imminent M5 Pro and M5 Max chips will run cooler and faster than ever before, as a year-old rumor about the way Apple Silicon chips are packaged resurfaces.

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a ...